Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-06-23
2008-10-07
Doan, Theresa T. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S686000, C257S730000, C257S777000, C257S787000, C257SE25006
Reexamination Certificate
active
07432600
ABSTRACT:
A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate.
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Doan Trung Tri
Klein Dean A.
Wood Alan G.
Doan Theresa T.
Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Dilinh
LandOfFree
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