Terminal, semiconductor device, terminal forming method and...

Details Terminal, semiconductor device, terminal forming method and... Terminal, semiconductor device, terminal forming method and...

2006-03-28

2006-03-28

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000

Reexamination Certificate

active

07019405

ABSTRACT:
In a terminal, a semiconductor device, a terminal forming method and a flip chip semiconductor device manufacturing method, it is possible to lessen damage to a semiconductor element due to vibration caused by an ultrasonic wave and settle misalignment and height unevenness of terminals. The terminal includes a pad provided on an active surface of an electric element having an IC chip, a metal post connected to the pad, and a projection electrode provided on the metal post.

REFERENCES:
patent: 6476502 (2002-11-01), Yamada et al.
patent: 6525408 (2003-02-01), Akram et al.
patent: 2003/0122253 (2003-07-01), Hsu
patent: 2003/0127734 (2003-07-01), Lee et al.
patent: 08-162491 (1996-06-01), None
patent: 08-264540 (1996-10-01), None
patent: 09-167771 (1997-06-01), None

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