Substrateless resin encapsulated semiconductor device

Details Substrateless resin encapsulated semiconductor device Substrateless resin encapsulated semiconductor device

1995-12-13

1999-10-19

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257666, 257676, 257690, 257787, H01L 2328, H01L 2348

Patent

active

059694262

ABSTRACT:
A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate on a transferring substrate to which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.

REFERENCES:
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5394009 (1995-02-01), Loo
patent: 5450283 (1995-09-01), Lin et al.
patent: 5461197 (1995-10-01), Hirvta et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5619070 (1997-04-01), Kozono

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