LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead,Configuration or pattern of bonds

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Bond pad structure for integrated circuit chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bond-pad with a single anchoring structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad and chip structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad in semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad metal layer geometry design

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pad structure of semiconductor device having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bonding pads for integrated circuits having copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bone-pad with pad edge strengthening structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Breaking out signals from an integrated circuit footprint

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Bumped die and wire bonded board-on-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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