Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2002-05-16
2004-02-03
Everhart, Caridad (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C438S125000, C438S129000, C438S106000, C257S693000, C257S700000
Reexamination Certificate
active
06686666
ABSTRACT:
BACKGROUND
An embodiment of the invention relates to printed circuit board layout techniques.
A printed wiring board, also referred to as a printed circuit board, is a structure that communicatively interconnects a number packaged integrated circuits (i.e., ICs), as part of an electronic system. For example, every notebook and desktop personal computer has a motherboard on which processor, system chipset, and main memory IC packages are installed. Each package is electrically connected to a separate group of conductive pads that are formed on a surface of the board. These pads may be referred as having a ‘footprint’ of that package. The pad to package connection may be made by, for instance, direct soldering the package to the pads, or mounting the package on a socket that itself is soldered to the pads.
The board has conductive signal lines formed in one or more signal routing layers. A signal line is typically routed between, and electrically connects, a pad for one package and one or more corresponding pads for another package. The process of determining or creating a route for a signal line to go from a pad within a footprint to a location outside of the footprint, without being too close or touching other pads or signal lines, is called ‘breaking out the signal’.
To support complex logic functions, an IC package uses a large number of signals and hence requires a correspondingly large number of pads in its footprint. If the signals that are to be broken out of a footprint are too numerous to fit on a single routing layer of a board, then additional routing layers must be provided in the board to break out all of the remaining signals. Each additional layer, however, may substantially increase the cost of manufacturing the board.
REFERENCES:
patent: 5847936 (1998-12-01), Forehand et al.
patent: 6194668 (2001-02-01), Horiuchi et al.
patent: 6215184 (2001-04-01), Ooto et al.
patent: 6388890 (2002-05-01), Kwong et al.
LandOfFree
Breaking out signals from an integrated circuit footprint does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Breaking out signals from an integrated circuit footprint, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Breaking out signals from an integrated circuit footprint will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3306421