Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-09-19
2006-09-19
Sarkar, Asok K. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S108000, C438S106000, C438S124000, C257SE21499, C257SE21506, C257SE21508
Reexamination Certificate
active
07109065
ABSTRACT:
An improved bumped chip carrier (BCC) package according to the present invention includes a resin-molded lead frame encapsulating an attached semiconductor integrated circuit (IC) and a plurality of interconnecting wire bonds attaching a plurality of contact pads on the IC to an associated plurality of solder-covered external contact terminals that are integrated in the lead frame. By integrally processing the external contact terminals, bonding wires may be affixed using a single wire bonding process. A method for manufacturing the BCC package preferably includes a dual photoresist patterning process accompanied by a dual wet etching process to create a plurality of highly reliable external contact terminals having improved bonding between the contact terminals and the encapsulating resin mold.
REFERENCES:
patent: 5856212 (1999-01-01), Chun
patent: 5882955 (1999-03-01), Huang et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 6008068 (1999-12-01), Yamada
patent: 6031292 (2000-02-01), Murakami et al.
patent: 6083776 (2000-07-01), Manteghi
patent: 6163069 (2000-12-01), Oohira et al.
patent: 6191494 (2001-02-01), Ooyama et al.
patent: 6211462 (2001-04-01), Carter, Jr. et al.
patent: 6278177 (2001-08-01), Ryu
patent: 6284818 (2001-09-01), Kawata et al.
patent: 6294830 (2001-09-01), Fjelstad
patent: 6306685 (2001-10-01), Liu et al.
patent: 6410979 (2002-06-01), Abe
patent: 6414385 (2002-07-01), Huang et al.
patent: 6646349 (2003-11-01), Pu et al.
patent: 6650012 (2003-11-01), Takahashi
patent: 6818976 (2004-11-01), Kang et al.
patent: 2001/0001069 (2001-05-01), Huang et al.
patent: 2001/0035569 (2001-11-01), Shibata
patent: 2001/0040286 (2001-11-01), Fujimoto et al.
patent: 2001/0048166 (2001-12-01), Miyazaki
patent: 2002/0096756 (2002-07-01), Kobayakawa
patent: 2002/0140061 (2002-10-01), Lee
patent: 2002/0160552 (2002-10-01), Minamio et al.
patent: 2003/0025201 (2003-02-01), Harada
patent: 2004/0159918 (2004-08-01), Lee
Ahn Sang Ho
Kang In Ku
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
Sarkar Asok K.
Yevsikov Victor V.
LandOfFree
Bumped chip carrier package using lead frame and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bumped chip carrier package using lead frame and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bumped chip carrier package using lead frame and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3576750