Bonding support for leads-over-chip process

Details Bonding support for leads-over-chip process Bonding support for leads-over-chip process

1996-01-11

1998-06-23

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, 438122, 438124, H01L 2160

Patent

active

057704791

ABSTRACT:
A method of forming a semiconductor memory device comprises the steps of providing a semiconductor die, forming a temporary protective material over a surface of the die, and attaching the die to a first lead frame portion. Next, a protective material is contacted with a second lead frame portion and, subsequently, the second lead frame portion is electrically connected with the second lead frame portion with bond pads on the first surface of the die with bond wires. Subsequent to electrically connecting the die and the second lead frame portion the protective material is removed.

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Tech Spray, Inc. Sales Brochure, Feb., 1994.

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