Ball grid array package stacking system

Details Ball grid array package stacking system Ball grid array package stacking system

2011-01-18

2011-01-18

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S109000, C257S706000, C257S686000, C257SE23101

Reexamination Certificate

active

07871862

ABSTRACT:
A ball grid array package stacking system includes: forming a heat spreader having a centrally located access port; mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port; coupling an integrated circuit die to the substrate; and coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof.

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