Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-04-05
2005-04-05
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S119000, C438S122000
Reexamination Certificate
active
06875634
ABSTRACT:
A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
REFERENCES:
patent: 5933709 (1999-08-01), Chun
patent: 6093584 (2000-07-01), Fjelstad
patent: 6218214 (2001-04-01), Panchou et al.
patent: 6423576 (2002-07-01), Hoffman
patent: 6538320 (2003-03-01), Tosaya et al.
Apale Hermes T.
Aquien Weddie
Ararao Virgil
Filoteo Dario
Merilo Leo
Estrada Michelle
Fourson George
Ishimaru Mikio
ST Assembly Test Services PTE LTD
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