Interlevel dielectric with air gaps to lessen capacitive couplin

Interlevel dielectric with air gaps to reduce permitivity

Intermetal dielectric layer for integrated circuits

Intermetal dielectric using HDP-CVD oxide and SACVD O3-TEOS

Intermetallic aluminides and silicides articles, such as...

Internal circuit structure of semiconductor chip with...

Internally reinforced bond pads

Interposer and method of making same

Interposer capacitor built on silicon wafer and joined to a...

Interposer for redistributing signals

Introduction of metal impurity to change workfunction of...

Inverse integrated circuit fabrication process

Ion beam dual damascene process

Ion implantation combined with in situ or ex situ heat...

Ion implantation for preventing polycide void

Ion mixing between two-step titanium deposition process for...

Ionized metal plasma (IMP) method for forming (111) oriented...

Ionized metal plasma deposition process having enhanced via...

Ionized metal plasma Ta, TaNx, W, and WNx liners for gate...

Iridium conductive electrode/barrier structure and method...