Internally reinforced bond pads

Details Internally reinforced bond pads Internally reinforced bond pads

2007-09-25

2007-09-25

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S622000, C438S623000, C438S624000, C438S625000, C438S626000, C438S627000, C257S738000, C257S758000

Reexamination Certificate

active

11030496

ABSTRACT:
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

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