Solutions of metal-comprising materials, and methods of...
Solutions of metal-comprising materials, methods of forming...
Solvent vapor-assisted plasticization of photoresist films...
Solving via-misalignment issues in interconnect structures...
Source alternating MOCVD processes to deposit tungsten...
Spacer - defined dual damascene process method
Specialized metal profile for via landing areas
Spin-on conductor process for integrated circuits
Spin-on-glass partial etchback planarization process
Spray dispensing method for applying liquid metal
Sputter deposition and annealing of copper alloy metallization
Sputter deposition and etching of metallization seed layer...
Sputtered tungsten diffusion barrier for improved...
Sputtering targets comprising aluminides or silicides
SRAM bit cell with self-aligned bidirectional local...
Stabilization of fluorine-containing low-k dielectrics in a...
Stabilization of Ni monosilicide thin films in CMOS devices...
Stabilization of the interface between tiN and A1 alloys
Stabilized photoresist structure for etching process
Stabilizing fluorine etching of low-k materials