Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-11-07
2006-11-07
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S631000, C438S633000, C438S638000, C438S675000, C438S687000
Reexamination Certificate
active
07132363
ABSTRACT:
Damascene processing is implemented with dielectric barrier films (50, 90, 91) for improved step coverage and reduced contact resistance. Embodiments include the use of two different dielectric films (50, 31) to avoid misalignment problems. Embodiments further include dual damascene (100A,100B) processing using Cu metallization (100).
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Erb Darrell M.
Wang Fei
Yang Kai
Advanced Micro Devices , Inc.
Nguyen Thanh
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