Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1995-12-19
1998-08-11
Breneman, R. Bruce
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438693, 156345LP, 451 9, 451278, 451287, 451292, C23F 300
Patent
active
057927090
ABSTRACT:
The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is smaller in diameter than the wafer and is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.
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Robinson Karl M.
Stroupe Hugh
Alanko Anita
Breneman R. Bruce
Micro)n Technology, Inc.
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