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Minute copper balls and a method for their manufacture

Metal fusion bonding – Solder form
Reexamination Certificate

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Multi-layer polymer-solder hybrid thermal interface material...

Metal fusion bonding – Solder form
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Multi-layer solder seal band for semiconductor substrates

Metal fusion bonding – Solder form
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Non-wicking solder preform

Metal fusion bonding – Solder form
Patent

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Oxidation-resistant reactive solders and brazes

Metal fusion bonding – Solder form
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Products for use in low temperature fluxless brazing

Metal fusion bonding – Solder form
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Reinforced solder preform

Metal fusion bonding – Solder form
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Seamless, ring-shaped brazing material and method for producing

Metal fusion bonding – Solder form
Patent

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Shaped solder pad for reflow soldering of surface mounting cylin

Metal fusion bonding – Solder form
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Shaped solder pad for surface mounting electronic devices and a

Metal fusion bonding – Solder form
Patent

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Slotted brazing alloy strip

Metal fusion bonding – Solder form
Patent

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SnAgAu solder bumps, method of manufacturing the same, and...

Metal fusion bonding – Solder form
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Socketable bump grid array shaped-solder on copper spheres

Metal fusion bonding – Solder form
Patent

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Solder ball

Metal fusion bonding – Solder form
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Solder ball and interconnection structure using the same

Metal fusion bonding – Solder form
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Solder ball holding terminal in a BGA arrangement

Metal fusion bonding – Solder form
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Solder balltape and method for making electrical connection...

Metal fusion bonding – Solder form
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Solder connection device

Metal fusion bonding – Solder form
Patent

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Solder connector device

Metal fusion bonding – Solder form
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Solder delivery and array apparatus

Metal fusion bonding – Solder form
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