Shaped solder pad for reflow soldering of surface mounting cylin

Details Shaped solder pad for reflow soldering of surface mounting cylin Shaped solder pad for reflow soldering of surface mounting cylin

1985-06-17

1986-08-12

Godici, Nicholas P.

Metal fusion bonding

Solder form

2281802, B23K 306

Patent

active

046051538

ABSTRACT:
A solder pad is provided at each end of a mounting position for a cylindrical electronic device on a circuit board. Each solder pad has two humps of solder spaced apart in a direction normal to the axis of the device, the humps defining a channel in which the end of a device can rest prior to being reflow soldered. The humps have a convex arcuate outer surface in plan view and when viewed in a direction parallel to the axis of the device has a profile which is of convex arcuate form. The humps are formed by depositing a thick patch of solder paste at each hump position and heating the circuit board and solder paste to melt the paste. After positioning of devices, the solder is reflowed to attach the devices.

REFERENCES:
patent: 3778530 (1973-12-01), Riemann
patent: 4376505 (1983-03-01), Wojcik

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