Multi-layer polymer-solder hybrid thermal interface material...

Metal fusion bonding – Solder form

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S295100

Reexamination Certificate

active

07014093

ABSTRACT:
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.

REFERENCES:
patent: 4782893 (1988-11-01), Thomas
patent: 5098320 (1992-03-01), Colleran et al.
patent: 5820014 (1998-10-01), Dozier, II et al.
patent: 5931222 (1999-08-01), Toy et al.
patent: 5981085 (1999-11-01), Ninomiya et al.
patent: 6008988 (1999-12-01), Palmer
patent: 6197859 (2001-03-01), Green et al.
patent: 6219243 (2001-04-01), Ma et al.
patent: 6292367 (2001-09-01), Sikka et al.
patent: 6343647 (2002-02-01), Kim et al.
patent: 6462410 (2002-10-01), Novotny et al.
patent: 6602777 (2003-08-01), Kao et al.
patent: 6751099 (2004-06-01), Vrtis et al.
patent: 6784540 (2004-08-01), Cardwell
patent: 6867978 (2005-03-01), Whittenburg et al.
patent: 2002/0135984 (2002-09-01), Greenwood et al.
patent: 2003/0150604 (2003-08-01), Koning et al.
patent: 2003/0178720 (2003-09-01), Rumer et al.
patent: 2003/0178730 (2003-09-01), Rumer et al.
patent: 2004/0066630 (2004-04-01), Whittenburg et al.
patent: 2004/0118501 (2004-06-01), Chiu et al.
patent: 2004/0180202 (2004-09-01), Lawton et al.
patent: 2004/0261980 (2004-12-01), Dani et al.
patent: 2004/0262372 (2004-12-01), Houle et al.
patent: 2005/0027055 (2005-02-01), Dani et al.
patent: 2005/0045855 (2005-03-01), Tonapi et al.
patent: 2005/0056365 (2005-03-01), Chan
patent: WO-02091395 (2002-11-01), None
patent: WO-05006361 (2005-01-01), None
Chang, Chin-An , “Enhanced Cu-Teflon adhesion by presputtering treatment: Effect of surface morphology changes”,Applied Physics Letters, 51(16), (Oct. 19, 1987), 1236-1238.
Perrins, L E., et al., “Mechanism for the adhesion of electroplated copper to polypropylene”,Plastics and Polymers, 39(144), (Dec. 1971),391-397.
International Search Report issued in connection with International App. No. PCT/US2004/018164 on May 25, 2005 (7 pgs.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-layer polymer-solder hybrid thermal interface material... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer polymer-solder hybrid thermal interface material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer polymer-solder hybrid thermal interface material... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3576948

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.