Metal fusion bonding – Solder form
Patent
1997-04-30
1999-03-16
Heinrich, Samuel M.
Metal fusion bonding
Solder form
428596, B23K 3102, B23K 3522
Patent
active
058819444
ABSTRACT:
The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.
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Cammarano Armando S.
Coffin Jeffrey T.
Courtney Mark G.
Drofitz, Jr. Stephen S.
Edwards David L.
Ahsan Aziz M.
Heinrich Samuel M.
International Business Machines - Corporation
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