Solder ball

Details Solder ball Solder ball

2006-08-29

2006-08-29

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Solder form

C228S246000, C420S570000

Reexamination Certificate

active

07097090

ABSTRACT:
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.

REFERENCES:
patent: 4173468 (1979-11-01), Gault
patent: 5120498 (1992-06-01), Cocks
patent: 5127969 (1992-07-01), Sekhar
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5308578 (1994-05-01), Wong
patent: 5653783 (1997-08-01), Ohzeki
patent: 5675889 (1997-10-01), Acocella et al.
patent: 5690890 (1997-11-01), Kawashima et al.
patent: 5919317 (1999-07-01), Tanahashi et al.
patent: 6189771 (2001-02-01), Maeda et al.
patent: 6205264 (2001-03-01), Jin et al.
patent: 6340113 (2002-01-01), Avery et al.
patent: 6367683 (2002-04-01), Rass et al.
patent: 6485843 (2002-11-01), Eslamy
patent: 6506448 (2003-01-01), Minogue
patent: 7-178587 (1995-07-01), None
patent: 07178587 (1995-07-01), None
patent: 07195189 (1995-08-01), None
patent: 10-109187 (1996-10-01), None
patent: 9-52191 (1997-02-01), None
patent: 10-137971 (1998-05-01), None
patent: 11-114691 (1999-04-01), None
patent: 2002-153990 (2002-05-01), None
Sato et al., Translation to JP 2002-153990, May 2002, 5 pages.

Affiliated with

Also associated with

Rating

Solder ball does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder ball, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder ball will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3698743