SnAgAu solder bumps, method of manufacturing the same, and...

Details SnAgAu solder bumps, method of manufacturing the same, and... SnAgAu solder bumps, method of manufacturing the same, and...

2007-05-22

2007-05-22

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Solder form

C228S180220, C438S612000, C257S778000

Reexamination Certificate

active

10949522

ABSTRACT:
Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third element, in which the first and third elements together form a compound having a plurality of intermediate phases and solidus lines.

REFERENCES:
patent: 5234153 (1993-08-01), Bacon et al.
patent: 6130476 (2000-10-01), LaFontaine et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6573537 (2003-06-01), Steigerwald et al.
patent: 6762506 (2004-07-01), Amagai et al.
patent: 2001/0010449 (2001-08-01), Chiu et al.
patent: 2001/0013423 (2001-08-01), Dalal et al.
patent: 2003/0222270 (2003-12-01), Uemura
patent: 2003/0222352 (2003-12-01), Kung et al.
patent: 2004/0201110 (2004-10-01), Venugopalan et al.
patent: 2004/0258556 (2004-12-01), Kim et al.
patent: 2005/0041934 (2005-02-01), Zama et al.
patent: 2005/0110161 (2005-05-01), Naito et al.

Affiliated with

Also associated with

Rating

SnAgAu solder bumps, method of manufacturing the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with SnAgAu solder bumps, method of manufacturing the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SnAgAu solder bumps, method of manufacturing the same, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3789959