Metal fusion bonding – Solder form
Patent
1994-01-05
1994-09-27
Heinrich, Samuel M.
Metal fusion bonding
Solder form
228246, 156 86, 428615, 174DIG8, H01R 472, B23K 300
Patent
active
053501055
ABSTRACT:
Composite solder articles contain a first portion of a first solder having a first melting point, T.sub.1, and a second portion of a second solder having a second melting point, T.sub.2, which is at least (T.sub.1 +10).degree. C. Such articles are useful as the sole solder-producing inserts in heat-recoverable solder connection devices. When the device is heated, the second solder will not melt until the first solder has melted and flowed. Thus the second solder portion can indicate when the first solder has flowed, and/or can control flow of the first solder.
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Delalle Jacques
Lamothe Michele
Ouaniche Mahrez
Passa Frederic
Roucaute Philippe
Burkard Herbert G.
Heinrich Samuel M.
Novack Sheri M.
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