Non-wicking solder preform

Details Non-wicking solder preform Non-wicking solder preform

1991-12-31

1993-02-09

Heinrich, Samuel M.

Metal fusion bonding

Solder form

228 13, 228215, B23K 3514

Patent

active

051847671

ABSTRACT:
Wicking-resistant solder preforms and methods for making such preforms are provided. The preforms include a solder layer for electrically mounting a lead to a printed circuit board upon heating the solder above its flow temperature. The preform also includes a flux layer disposed in contact with the solder layer and a wicking barrier disposed on a component-facing side of the solder layer for minimizing solder wicking along the lead during subsequent reflow soldering operations.

REFERENCES:
patent: 3396894 (1968-08-01), Ellis
patent: 3989331 (1976-11-01), Hanlon
patent: 4723923 (1988-02-01), Senor et al.
Insulation/Circuits, Production Soldering Clinic, pp. 51,52, Oct., 1980.
Computer Design, Technology Review, p. 108, Nov., 1980.

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