Metal fusion bonding – Solder form
Patent
1998-07-09
2000-06-06
Heinrich, Samuel M.
Metal fusion bonding
Solder form
257693, 439 74, B23K10138, H05K 100, H01L 2348
Patent
active
060707828
ABSTRACT:
An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.
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Brofman Peter Jeffrey
Ghosal Balaram
Jackson Raymond Alan
Lidestri Kathleen Ann
Puttlitz, Sr. Karl J.
Ahsan Aziz M.
Heinrich Samuel M.
International Business Machines - Corporation
Tomaszewski John J.
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