Reinforced solder preform

Details Reinforced solder preform Reinforced solder preform

1997-12-04

2000-08-01

Ryan, Patrick

Metal fusion bonding

Solder form

228246, B23K 3514, B23K 3512

Patent

active

060954000

ABSTRACT:
There is disclosed herein a solder preform for use on printed circuit boards to provide reinforced solder joints thereon. The preform 70 comprises a solder body 72 made of solder, and a thin metallic member 30 attached to the solder body 72. The member 30 may be a metallic screen or foil having holes or perforations 32 therethrough, or may be a non-perforated metallic foil. A method for producing such reinforced solder joints is also disclosed.

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