Plated-through interconnect solder thief

Details Plated-through interconnect solder thief Plated-through interconnect solder thief

1993-01-19

1993-09-07

Rosenbaum, Mark

Metal fusion bonding

Process

Plural joints

22818022, 228215, 228260, B23K 3102

Patent

active

052421007

ABSTRACT:
A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.

REFERENCES:
patent: 3726007 (1973-04-01), Keller
patent: 3867672 (1975-02-01), Pizzigoni
patent: 4339784 (1982-07-01), Shearer
patent: 4835345 (1989-05-01), Haarde

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