Pivotal wire bonding stage and method of use

Details Pivotal wire bonding stage and method of use Pivotal wire bonding stage and method of use

1992-12-07

1993-09-07

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, 228 491, H01L 2160

Patent

active

052421031

ABSTRACT:
A method and apparatus are provided for making a continuous wire bond (139) around an angle of a workpiece (101). A pivotal stage (110) having clamp assembles (104, 107) are mounted onto a base (102). A workpiece (110) is placed and secured in clamp assemblies (104, 107). A first wire bond site on a first surface is selected and formed. Workpiece (110) is pivotally rotated to a second surface position at an angle to the first surface where a second wire bond site is selected and formed, thereby making a continuous wire bond from the first selected site to the second selected site.

REFERENCES:
patent: 4597522 (1986-07-01), Kobayashi
patent: 5060841 (1991-10-01), Oshima et al.

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