Package to semiconductor chip active interconnect site method

Details Package to semiconductor chip active interconnect site method Package to semiconductor chip active interconnect site method

1991-07-11

1992-11-10

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2281802, 228254, H01L 2160

Patent

active

051617293

ABSTRACT:
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at lest one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.

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Electronics, Stephen E. Grossman, "Film-Carrier Technique Automates the Packaging of IC Chips", pp. 89-95, May 16, 1974.
Solders and Soldering, by Howard Manko, McGraw-Hill Book Company, pp. 38-39.
U.S. Department of Defense Military Standard 883C, Method 1010.5, titled "Temperature Cycling", Aug. 25, 1983.

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