Pad grid array for receiving a solder bumped chip carrier

Details Pad grid array for receiving a solder bumped chip carrier Pad grid array for receiving a solder bumped chip carrier

1989-04-06

1990-07-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

174263, 361406, B23K 120, H05K 334

Patent

active

049401815

ABSTRACT:
A pad grid array comprises an array of cavities (12) formed in a circuit carrying substrate (10) that are metallized (18, 20, and 22) to provide electrical conductivity. The metallized cavities are preferably hemispherical in shape and approximately the size of the solder bumps (30) coupled to a solder bumped chip carrier (28) that will be mounted thereon. Flux (26) is applied to each of the metallized cavities before positioning the solder bumped chip (28) carrier over the pad grid array. Proper mounting can be detected by tactile sensing in either human or robotic assemblers when the solder bumps "drop" into the metallized cavities.

REFERENCES:
patent: 3335489 (1967-08-01), Grant
patent: 3379937 (1968-04-01), Shepherd
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3552004 (1971-01-01), Hagelbarger et al.
patent: 4075416 (1978-02-01), Kuttner et al.
patent: 4081601 (1978-03-01), Dinella et al.
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4642160 (1987-02-01), Burgess

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