Plated compliant lead

Details Plated compliant lead Plated compliant lead

1993-05-14

1994-03-15

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

29830, 228175, 228254, H05K 334

Patent

active

052940390

ABSTRACT:
A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surf ace for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.

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patent: 5210939 (1993-05-01), Mallik et al.
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