Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2001-07-31
2003-11-18
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S180210, C228S246000, C428S671000, C257S697000, C174S260000, C174S267000
Reexamination Certificate
active
06648211
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a pin standing (pin grid array) resin substrate having pins as input/output terminals erected thereon, a method of making the pin standing resin substrate, a pin as an input/output terminal for use in the pin standing substrate, and a method of making the pin, and more particularly to a pin standing resin substrate having increased bonding strength between the pin and the resin substrate, a making method of the pin standing resin substrate, a pin capable of increasing the bonding strength with the resin substrate, and a method of making the pin.
2. Description of the Related Art
Conventionally, a pin standing resin substrate has pins as input/output terminals standing on a resin substrate made of resin or a composite material containing resin.
For example, a pin standing resin substrate
201
is shown in a partly enlarged cross sectional view of FIG.
12
. This pin standing resin substrate
201
is constituted by a resin substrate
203
having an almost (substantially) rectangular and substantially laminar (plate-like) shape and a number of pins
221
standing thereon.
The resin substrate
203
has a resin insulating layer
205
with a wiring layer (not shown) formed inside or on the surface, with a number of pin-pads
209
exposed from a solder resist layer
207
being formed on the side of a main surface
203
A (upward in the figure).
On the other hand, pin
221
may be made of
194
alloy, for example, and comprises a rod-like portion
221
A of substantially cylindrical shape and an enlarged diameter portion
221
B like a substantial disk formed at one end on the side of the pin-pad
209
. The pin
221
is fixed to the resin substrate
203
by bonding the whole of the enlarged diameter portion
221
B and a part of the rod-like portion
221
A on the side of the enlarged diameter portion
221
B with the pin-pad
209
by solder HD. The pin
221
may be made of copper base metal such as pure copper, phosphor bronze, german silver and beryllium bronze, or iron base metal such as kovar (Fe—Ni—Co alloy) and 42 alloy (Ni(42 wt %)—Fe alloy), as well as 194 alloy.
However, such pin standing resin substrate
201
may be broken in a junction part between the pin
221
and the pin-pad
209
when stress is applied to the pin
221
, because the bonding strength between the pin
221
and the pin-pad
209
is weak. Or such pin standing substrate
201
may be broken because the pin-pad
209
or a portion around it may be peeled from the substrate.
SUMMARY OF THE INVENTION
This invention has been achieved in the light of the above-mentioned problems of the prior art. It is therefore an object of the invention to provide a pin standing resin substrate unlikely to break in a junction part between a pin and a pin-pad or in a part around a pin pad due to stress applied to the pin, a making method of the pin standing resin substrate, a pin for use in the pin standing substrate, and a method of making the pin.
The above objectives have been achieved by providing a pin standing resin substrate comprising:
a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and
a pin soldered to the pin-pad,
wherein the pin has been thermally treated so as to soften the pin prior to soldering to the pin-pad, and comprises a rod-like portion made of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.
The above objectives have also been achieved providing a method of making a pin standing resin substrate, which comprises:
thermally treating a pin by heating at a temperature of 500° C. or higher so as to soften the pin, wherein the pin comprises a rod-like portion comprising copper base metal and an enlarged diameter portion made of the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion; and
soldering at least the enlarged diameter portion of the pin to a pin-pad so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface.
The above objectives have also been achieved by providing a method of making a pin standing resin substrate, which comprises:
reducing the Vickers hardness (Hv) of a pin to 135 or less, wherein the pin comprises a rod-like portion and an enlarged diameter portion made of the same material comprising one of pure copper and 194 alloy, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion; and
soldering at least the enlarged diameter portion of the pin to a pin-pad so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface.
The above objectives have further been achieved by providing a method of making a pin standing resin substrate, which comprises: soldering a pin-pad with at least an enlarged diameter portion of a pin, so as to fix the pin to a resin substrate,
wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface, the pin having a Vickers hardness (Hv) of 135 or less, and the pin comprising a rod-like portion and an enlarged diameter portion made of the same material comprising one of pure copper and 194 alloy, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion.
The above objectives have further been achieved by providing a method of making a pin for use in a pin standing substrate having at least one pin as an input/output terminal standing thereon, which comprises:
thermally treating the pin by heating at a temperature of 500° C. or higher so as to soften the pin,
wherein the pin comprises a rod-like portion comprising copper base metal and an enlarged diameter portion made of the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion.
The above objectives have further been achieved by providing a pin for use in a pin standing substrate having at least one pin as an input/output terminal standing thereon, which comprises:
a rod-like portion comprising copper base metal; and
an enlarged diameter portion made of the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion,
wherein the pin has been thermally treated by heating at 500° C. or higher so as to soften the pin.
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Miyamoto Noritaka
Saiki Hajime
Dunn Tom
Edmondson L.
NGK Spark Plug Co. Ltd.
Sughrue & Mion, PLLC
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