Solder ball array package and a method of encapsulation
Solder glass and electrical device employing same
Solder glass and electrical device employing same
Solder glass and electrical device employing same
Solder glass and electrical device employing the same
Solid printed substrate and electronic circuit package using the
Solution to mold wire sweep in fine pitch devices
Sound and vibration damper in a motor vehicle electrical...
Spatter, dust and rain-proof plastic safety case intended for ex
Split cavity wall plating for an integrated circuit package
Stabilization of semiconductor device package leads
Stacked multi-chip modules and method of manufacturing
Staggered land pad pattern on substrate for tab interconnection
Static converter module with mounting lugs
Stationary housing with wall elements made of plastic
Storage box for electronic control units
Stress relief bend useful in an integrated circuit...
Stress relief bend useful in an integrated circuit...
Stress resistant land grid array (LGA) module and method of...
Structural support for direct lid attach