Stabilization of semiconductor device package leads

Details Stabilization of semiconductor device package leads Stabilization of semiconductor device package leads

1982-05-17

1984-11-13

Gonzales, John

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 357 74, H05K 502

Patent

active

044827814

ABSTRACT:
The leads on a VLSI semiconductor package are bent and secured to the package so as to improve their stability. The thin fragile leads are thereby substantially immobilized so that they will not be deformed during post packaging handling and testing.

REFERENCES:
patent: 3984166 (1976-10-01), Hutchison

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