Solder ball array package and a method of encapsulation

Details Solder ball array package and a method of encapsulation Solder ball array package and a method of encapsulation

1996-05-24

2000-10-10

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257787, 26427217, H01L 2302

Patent

active

061303836

ABSTRACT:
A solder ball array package has a mould gate tape that is attached on top of a portion of the top surface of a leadless circuit carrying insulating substrate and on top of a portion of the top metallization pattern. The mould gate tape, which is optionally removable after completion of the moulding process, is such that it does not interfere with the design of the top side metallization pattern.

REFERENCES:
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5241133 (1993-08-01), Mullen et al.
patent: 5635671 (1997-06-01), Freyman et al.
Patent Abstracts of Japan, vol. 014 No. 365 (E-0961), Aug. 8, 1990, and JP-A-02 129933 (Mitsubishi Electric Corp.) May 18, 1990.
Patent Abstracts of Japan, vol. 007, No. 072 (E-166), Mar. 25, 1983, and JP-A-28 000159 (Nippon Denki KK) Jan. 5, 1983.
Patent Abstracts of Japan, vol. 016, No. 486 (E-1276), Oct. 8, 1992, and JP-A-04 177753 (Citizen Watch Co. Ltd.) Jun. 24, 1992.
Patent Abstracts of Japan, vol. 017, No. 687 (E-1478), Dec. 16, 1993, and JP-A-05 235069 (Matsushita Electric Ind. Co. Ltd.) Sep. 10, 1993.

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