Urethane encapsulated integrated circuits and compositions there
Use of a down-bond as a controlled inductor in integrated...
Use of a down-bond as a controlled inductor in integrated...
Use of a dual-tone resist to form photomasks including...
Use of a polymer spacer and Si trench in a bitline junction...
Use of a reference fiducial on a semiconductor package to...
Use of amorphous aluminum oxide on a capacitor sidewall for...
Use of an alloying element to form a stable oxide layer on...
Use of an energy source to convert precursors into patterned...
Use of an internal on-chip inductor for electrostatic...
Use of an oxide surface to facilitate gate break on a carrier su
Use of an oxide surface to facilitate gate break on a...
Use of atomic oxygen process for improved barrier layer
Use of barrier refractive or anti-reflective layer to...
Use of boron carbide as an etch-stop and barrier layer for...
Use of conductive particles in a nonconductive body as an integr
Use of DAR coating to modulate the efficiency of laser fuse...
Use of DAR coating to modulate the efficiency of laser fuse...
Use of DAR coating to modulate the efficiency of laser fuse...
Use of deep-level transitions in semiconductor devices