Use of conductive particles in a nonconductive body as an integr

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257665, H01L 2702

Patent

active

058348247

ABSTRACT:
A novel antifuse includes a composite of conductive particles dispersed throughout a nonconductive matrix, which composite is located inside an antifuse via. The antifuse via is defined by a dielectric layer that separates two electrodes. The electrodes can be located in the same conductive layer plane (typically parallel to and isolated from one another) or in two different conductive planes (typically formed transverse to one another and separated by a dielectric with an antifuse via formed therein). The electrodes can be coupled to, for example, active or passive regions of the integrated circuit. One embodiment of an antifuse (also called "composite antifuse") has only the composite in an antifuse via between the two conductive layers. Another embodiment of an antifuse (also called "hybrid antifuse") includes in addition to the composite, one or more thin dielectric layers also located in the antifuse via between the two conductive layers.

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