Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1998-02-05
1999-10-19
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
438476, H01L 23495
Patent
active
059694270
ABSTRACT:
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
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Micro)n Technology, Inc.
Thai Luan
Thomas Tom
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