Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – Transmission line or shielded
Reexamination Certificate
2006-02-21
2006-02-21
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Superconductive contact or lead
Transmission line or shielded
C257S663000, C257S664000, C257S666000, C257S684000, C257S531000
Reexamination Certificate
active
07002238
ABSTRACT:
A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality of die pads formed thereon. The package includes a heat slug upon which the semi conductive die resides, a plurality of package pins, a plurality of bond wires, a downbond rail, and a plurality of downbonds. Each of the bond wires couples between a corresponding die pad and a corresponding package pin. The downbond rail couples to the heat slug. At least one downbond couples between a die pad corresponding to the first portion of the RF circuit and a respective location on the downbond rail, serves as an inductor for a second portion of the RF circuit, may include a plurality of downbonds coupled in parallel, and has a length and/or a diameter selected to provide a desired inductance.
REFERENCES:
patent: 6621140 (2003-09-01), Gibson et al.
patent: 6828658 (2004-12-01), Schmitz et al.
Broadcom Corporation
Garlick Bruce
Garlick Harrison & Markison LLP
Nguyen Cuong
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