Urethane encapsulated integrated circuits and compositions there

Details Urethane encapsulated integrated circuits and compositions there Urethane encapsulated integrated circuits and compositions there

1997-03-18

1999-07-27

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257788, 257790, H01L 23495

Patent

active

059295120

ABSTRACT:
Composition, method, and products for the environmental protection of integrated circuits comprising a robotically dispensible, wave solderable, low moisture absorbing urethane polymer reaction product of an aliphatic isocyanate, a flexibilizing low molecular weight rubbery polymer having isocyanate reactive hydroxyl terminals, and a diamine arranged to bodily encapsulate the integrated circuit within a dam of thixotropic version of the same polymer, the encapsulation being free of popcorning response to rapid heat rise after high humidity conditioning and otherwise superior as an IC encapsulant.

REFERENCES:
patent: 3953877 (1976-04-01), Sigusch et al.
patent: 5285104 (1994-02-01), Kondo et al.
patent: 5397401 (1995-03-01), Toma et al.
patent: 5457341 (1995-10-01), West
patent: 5637156 (1997-06-01), Kubota et al.
patent: 5637914 (1997-06-01), Tanaka et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5731629 (1998-03-01), Woodward

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