Use of a polymer spacer and Si trench in a bitline junction...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S311000, C257SE29309, C257SE29226, C257SE21409

Reexamination Certificate

active

07906807

ABSTRACT:
Memory devices having improved TPD characteristics and methods of making the memory devices are provided. The memory devices contain two or more memory cells on a semiconductor substrate and bit line dielectrics between the memory cells. The bit line dielectrics can extend into the semiconductor. The memory cell contains one or more charge storage nodes, a first poly gate, a pair of first bit lines, and a pair of second bit lines. The second bit line can be formed at a higher energy level, a higher concentration of dopants, or a combination thereof compared to an energy level and a concentration of dopants of the first bit line.

REFERENCES:
patent: 5448090 (1995-09-01), Geissler et al.
patent: 5889305 (1999-03-01), Choi et al.
patent: 6037194 (2000-03-01), Bronner et al.
patent: 6140171 (2000-10-01), Allen et al.
patent: 6265292 (2001-07-01), Parat et al.
patent: 6274902 (2001-08-01), Kauffman et al.
patent: 6562696 (2003-05-01), Hsu et al.
patent: 6744105 (2004-06-01), Chen et al.
patent: 7125763 (2006-10-01), Sobek et al.
patent: 7183662 (2007-02-01), Kim et al.
patent: 7253055 (2007-08-01), Mokhlesi et al.
patent: 7294878 (2007-11-01), Tanaka et al.
patent: 2007/0196985 (2007-08-01), Ozawa et al.
patent: 2007/0241390 (2007-10-01), Tanaka et al.
patent: 2007/0269948 (2007-11-01), Manger
patent: 2008/0111166 (2008-05-01), Kim et al.
patent: 2008/0315174 (2008-12-01), Kang et al.
U.S. Office Action dated Apr. 2, 2009 corresponding to U.S. Appl. No. 11/835,538, filed Aug. 8, 2007.
U.S. Office Action dated Oct. 30, 2009 corresponding to U.S. Appl. No. 11/835,538, filed Aug. 8, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Use of a polymer spacer and Si trench in a bitline junction... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of a polymer spacer and Si trench in a bitline junction..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of a polymer spacer and Si trench in a bitline junction... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2776102

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.