LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Thermally contained/insulated phase change memory device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Thermally contained/insulated phase change memory device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally coupling electrically decoupling cooling device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally coupling electrically decoupling cooling device...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Thermally efficient integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Thermally enhanced and mechanically balanced flip chip package a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Thermally enhanced and mechanically balanced flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced cavity-down integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thermally enhanced component interposer: finger and net...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermally enhanced component substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced electronic flip-chip packaging with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced electronic flip-chip packaging with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Thermally enhanced high density semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced integrated circuit packaging system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thermally enhanced lead-under-paddle I.C. leadframe