4. Active solid-state devices (e.g., transistors, solid-state diode
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Stacked package module and board having exposed ends

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked package structure of image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
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Stacked package structure of image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked packages and systems incorporating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Stacked packages with interconnecting pins

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked packages with interconnecting pins

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked packaging designs offering inherent anti-tamper...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked paddle micro leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Stacked paired die package and method of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked pixel for high resolution CMOS image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device
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Stacked polysilicon layer for boron penetration inhibition

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Stacked quantum well aluminum indium gallium nitride light emitt

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Having graded composition
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Stacked redistribution layer (RDL) die assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked redistribution layer (RDL) die assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Stacked semiconductor apparatus and electronic device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked semiconductor chip package having external terminal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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