Stacked packaging designs offering inherent anti-tamper...

Details Stacked packaging designs offering inherent anti-tamper... Stacked packaging designs offering inherent anti-tamper...

2005-06-01

2009-12-29

Chu, Chris C (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25013, C257S723000, C257S738000, C438S108000

Reexamination Certificate

active

07638866

ABSTRACT:
An electronic device includes a die, a first circuit substrate connected to the die, and a second circuit substrate closely coupled to the first circuit substrate. The die is located between the first and second circuit substrates and is protected from tampering by the close coupling of the first and second circuit substrates. The circuit substrates may be circuit carrying elements (e.g. circuit boards) or may be additional die, may be any number of other substrates, and/or may be a combination of substrates. The device may include a cavity such that the die is located in the cavity. The cavity could be formed by any number of means. The device may also include a second die connected to the second substrate such that the first die and second die are located in proximity to each other on opposite sides of the cavity.

REFERENCES:
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patent: 2002/0053723 (2002-05-01), Matsuura
patent: 2002/0074652 (2002-06-01), Pierce
patent: 2003/0127749 (2003-07-01), Lin et al.
patent: 2003/0197260 (2003-10-01), Nishimura et al.

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