LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Tape having implantable conductive lands for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Tape having implantable conductive lands for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape mounted semiconductor apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape package having test pad on reverse surface and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Tape stiffener, semiconductor device component assemblies...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Tape substrate and semiconductor module for smart card,...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Tape substrates with mold gate support structures that are...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape under frame for conventional-type IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape under frame for conventional-type IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape wiring substrate and tape package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Tape with solder forms for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Tape-carrier-package semiconductor device and a liquid...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Tape-fixed leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Tapered dielectric and conductor structures and applications...