Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2011-03-29
2011-03-29
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257SE23010, C257SE23005
Reexamination Certificate
active
07915727
ABSTRACT:
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
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Cho Kyong-soon
Cho Young-sang
Choi Kyoung-Sei
Chung Ye-chung
Ha Jeong-kyu
Muir Patent Consulting, PLLC
Potter Roy K
Samsung Electronics Co,. Ltd.
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