Tape for heat dissipating member, chip on film type...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S706000, C257SE23010, C257SE23005

Reexamination Certificate

active

07915727

ABSTRACT:
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

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patent: 6300168 (2001-10-01), Takeuchi
patent: 6861750 (2005-03-01), Zhao et al.
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patent: 7259448 (2007-08-01), Zhang et al.
patent: 2008/0258290 (2008-10-01), Nakajima
patent: 09-066620 (1997-03-01), None
patent: 11-176887 (1999-07-01), None
patent: 2005-108387 (2005-04-01), None
patent: 2006-064939 (2006-03-01), None
patent: 10-2004-0004942 (2004-01-01), None
patent: 10-2007-0056499 (2007-06-01), None
patent: 10-2008-0011802 (2008-02-01), None

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