Tape substrates with mold gate support structures that are...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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C257S668000

Reexamination Certificate

active

07057297

ABSTRACT:
A mold gate of a tape substrate includes an aperture formed in the flexible dielectric film of the tape substrate and a support element which is carried by a surface of the flexible dielectric film, is substantially coplanar with conductive traces carried by the flexible dielectric film, and may be formed from the same material as the conductive traces. The aperture of the mold gate may be formed by die cutting or etching processes. The support element of the mold gate may be fabricated by patterning a conductive film and formed at substantially the same time as the conductive traces of the tape substrate are formed. Packaging methods and degating methods that include use of the tape substrate are also within the scope of the present invention.

REFERENCES:
patent: 5196917 (1993-03-01), Ueda et al.
patent: 5750421 (1998-05-01), Kasai et al.
patent: 5981873 (1999-11-01), Heo
patent: 6329606 (2001-12-01), Freyman et al.
patent: 2002/0180010 (2002-12-01), Tsubosaki et al.
patent: 0 961 317 (1999-12-01), None
Search Report, Mar. 9, 2005, 6 pages.
Patent Abtracts of Japan, JP 03-106045 A, Mitsubishi Electric Corp., May 2, 1991.
Patent Abstracts of Japan, JP 05-211186 A, NEC Corp., Aug. 20, 1993.
Patent Abstracts of Japan, JP 06-151515 A, NEC Corp, May 31, 1994.

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