Tape with solder forms for semiconductor devices

Details Tape with solder forms for semiconductor devices Tape with solder forms for semiconductor devices

1997-04-23

1998-05-12

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257737, 257738, 257778, 257779, 257780, H01L 2348

Patent

active

057510687

ABSTRACT:
An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed circuit boards. The solder forms are coupled to conductive pads of the electronic component through through-holes in the insulative tape. The solder forms may be shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. The insulative tape is thermally conductive and heat resistant. The tape may be made of an organic material such as an elastomer. The tape may further have impregnated materials such as ceramic, aluminum nitride, or solder flux to improve its thermal, mechanical, and/or electrical properties.

REFERENCES:
patent: 5258648 (1993-11-01), Lin
patent: 5363277 (1994-11-01), Tanaka
patent: 5438223 (1995-08-01), Higashi et al.
IBM Technical Disclosure Bulletin, vol. 36 No. 09B Sep. 1993 (Bump Tape Connector).

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