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TSOP type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Twin transistor device with improved collector-base isolation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Two die semiconductor assembly and system including same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Two piece assembly for the selection of pinouts and bond options

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Two-pole SMT miniature housing for semiconductor components...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Two-pole SMT miniature housing for semiconductor components...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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U-shape tape for BOC FBGA package to improve moldability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Ultra-high density warp-resistant memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Ultra-high density warp-resistant memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Ultra-thin composite surface finish for electronic packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Ultra-thin noble metal coatings for electronic packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Ultra-thin semiconductor package device using a support tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Ultrathin leadframe BGA circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Under bump metallization structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Underfill coating for LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Unit type clip lead terminal, clip lead terminal connecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Universal lead frame type of quad flat non-lead package of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Universal test die and method for fine pad pitch designs

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Urethane encapsulated integrated circuits and compositions there

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Use of discrete conductive layer in semiconductor device to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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