LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Twin transistor device with improved collector-base isolation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Two die semiconductor assembly and system including same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Two piece assembly for the selection of pinouts and bond options

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Two-pole SMT miniature housing for semiconductor components...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Two-pole SMT miniature housing for semiconductor components...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

U-shape tape for BOC FBGA package to improve moldability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Ultra-high density warp-resistant memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Ultra-high density warp-resistant memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Ultra-thin composite surface finish for electronic packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ultra-thin noble metal coatings for electronic packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Ultra-thin semiconductor package device using a support tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ultrathin leadframe BGA circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Under bump metallization structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Underfill coating for LOC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Unit type clip lead terminal, clip lead terminal connecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Universal lead frame type of quad flat non-lead package of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Universal test die and method for fine pad pitch designs

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Urethane encapsulated integrated circuits and compositions there

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Use of discrete conductive layer in semiconductor device to...