Universal test die and method for fine pad pitch designs

Details Universal test die and method for fine pad pitch designs Universal test die and method for fine pad pitch designs

1995-01-13

1997-10-07

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257734, 257736, 257737, 257738, 257739, 257750, 257773, 257781, 257782, 257 48, H01L 23495

Patent

active

056751796

ABSTRACT:
A universal semiconductor interconnect test structure and method for using the test structure is provided for detecting the presence of electrical open or short circuits within the test package. In one embodiment, the test structure comprises a layer of electrically non-conductive substrate and a bonding layer of electrically conductive material over the substrate layer. In a second embodiment, the universal test die comprises a layer of electrically non-conductive substrate and a pattern of electrically conductive material over the substrate layer, wherein the pattern forms a continuous array of individual bonding areas, each of the bonding areas being electrically isolated from adjacent bonding areas by a gap, and wherein the effective pitch of the bonding areas is not more than 25 microns. The universal test die of the present invention is suitable for developing wire bond and mold processes for all pad pitches, all pad layout designs, all package types, and all pin counts. The test die of the present invention greatly accelerates fine pitch development and avoids the burden of multiple test die inventory control. Additionally, the test die of the present invention simplifies wire bond programming and test program development.

REFERENCES:
patent: Re35119 (1995-12-01), Blonder et al.
patent: 3517278 (1970-06-01), Hager
patent: 5501006 (1996-03-01), Gehman et al.

Affiliated with

Also associated with

Rating

Universal test die and method for fine pad pitch designs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Universal test die and method for fine pad pitch designs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal test die and method for fine pad pitch designs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2359747