Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2006-04-21
2010-02-02
Landau, Matthew C (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C438S033000, C438S068000, C438S113000, C438S114000, C438S458000, C438S460000, C438S465000
Reexamination Certificate
active
07656012
ABSTRACT:
A chip-scale or wafer-level-package, having passivation layers on substantially all surfaces thereof to form a hermetically sealed-package, is provided. The package may be formed by disposing a first passivation layer on the passive or backside surface of a semiconductor wafer. The semiconductor wafer may be attached to a flexible membrane and diced, such as by a wafer saw, to separate the semiconductor devices. Once diced, the flexible membrane may be stretched so as to laterally displace the individual semiconductor devices away from one another and substantially expose the side edges thereof. Once the side edges of the semiconductor devices are exposed, a passivation layer may be formed on the side edges and active surfaces of the devices. A portion of the passivation layer over the active surface of each semiconductor device may be removed so as to expose conductive elements formed therebeneath.
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Landau Matthew C
Micro)n Technology, Inc.
Mitchell James M
TraskBritt
LandOfFree
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