Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2006-08-01
2008-11-04
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257SE23010, C257S690000, C257S737000, C257S693000, C257S774000, C361S755000, C361S783000, C361S777000, C361S754000, C324S754090, C324S760020, C324S755090
Reexamination Certificate
active
07446398
ABSTRACT:
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from a semiconductor chip attached thereto. The pattern includes a central portion and a peripheral portion with a transition portion therebetween. The transition portion has a lower pattern density than the central portion and peripheral portions. In the peripheral portion is at least one outer portion having a pattern density less than the average pattern density of the central portion. The outer portions of reduced pattern density may be the corner sections in a rectangular bump pattern and may further include channels that are void of contact pads. The peripheral portion may include an average pitch between most of the rows and columns, but also an increased pitch between some adjacent rows and columns.
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Amkor Technology, Enabling Technologies, “Flip Chip Packaging Technology Solution” at http://www.amkor.com/enablingtechnologies/FlipChip/index.cfm, Jul. 12, 2006, 8 pages.
Hou Shang-Yun
Hsiao Yung-Kuan
Niu Pao-Kang
Tsai Hao-Yi
Tsao Pei-Haw
Duane Morris LLP
Taiwan Semiconductor Manufacturing Co. Ltd.
Williams Alexander O
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